惯性MEMS、可穿戴、集成光电传感等智能感知器件与系统。

聚焦交叉前沿基础研究，着力解决集成化感知器件和系统的关键技术。近五年来，以第一/通讯(含共同)作者的身份在Nature(1篇)、Nature Electronics(2篇)、Nature Biomedical Engineering(1篇)、Nature Photonics(1篇)、Nature Reviews Electrical Engineering(1篇)、IEEE Transactions on Industrial Electronics(3篇)等多个高水平期刊上发表论文22篇和授权发明专利12项(含PCT专利5项)，研究成果被Nature(两次)、Nat. Electron.、Nat. Biomed. Eng.、Science Bulletin(两次)等杂志亮点评述。获清华大学优秀博士论文奖，北京市优秀毕业生奖，中国惯性技术学会优秀博士论文奖和国家高层次青年人才项目支持。

代表性论文（#共同一作）

[1]: Bo Hou, Dingzhu Yang, et al. "A tactile oral pad based on carbon nanotubes for multimodal haptic interaction." Nature Electronics (2024): 1-11.

[2]: Bo Hou#, Luying Yi#, et al. "A swallowable X-ray dosimeter for the real-time monitoring of radiotherapy." Nature Biomedical Engineering (2023): 1-10. (Highlighted by Nature)

[3]: Bo Hou#, Luying Yi#, et al. "An interactive mouthguard based on mechanoluminescence -powered optical fibre sensors for bite-controlled device operation." Nature Electronics 5.10 (2022): 682-693.

[4]: Bo Hou, Qiushui Chen, et al. "Materials innovation and electrical engineering in X-ray detection." Nature Reviews Electrical Engineering (2024): 1-17.

[5]: Luying Yi#, Bo Hou#, et al. "X-ray-to-visible light-field detection through pixelated color conversion." Nature (2023): 1-10. (Highlighted by Nature)

[6]: Luying Yi#, Bo Hou#, et al. " Nature Photonics 5.10 (2022): 682-693.

[7]: Bo Hou, and Xiaogang Liu. "Stretching boundaries in neurophysiological monitoring." BMEMat 1, no. 4 (2023): e12054.

[8]: Bo Hou, Li Chao et al., “Design, Optimization and Compensation of a High Precision Single-excitation Absolute Capacitance Angular Encoder Up to ±4''”. IEEE Transactions on Industrial Electronics 66.10 (2018): 8161-8171.

[9] Bo Hou, Zhou Bin, et al., “A full 360° measurement range liquid capacitive inclinometer with a triple- eccentric-ring sensing element and differential detection scheme”. IEEE Transactions on Industrial Electronics 67.5 (2019): 4216-4225.

[10] Bo Hou, Zhou Bin, et al., “High-Precision Incremental Capacitive Angle Encoder Developed by Micro Fabrication Technology”. IEEE T